Semiconductor package and stacked semiconductor package having the same
A semiconductor package includes a substrate having a substrate body possessing a first region, a second region which is defined around the first region and a third region which is defined around the second region. Wiring lines are placed on the substrate body, and the wiring lines have first ends t...
Saved in:
Main Authors | , , , , , |
---|---|
Format | Patent |
Language | English |
Published |
30.10.2012
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | A semiconductor package includes a substrate having a substrate body possessing a first region, a second region which is defined around the first region and a third region which is defined around the second region. Wiring lines are placed on the substrate body, and the wiring lines have first ends that extend to the third region. Connection patterns are placed in the third region and are electrically connected to the first ends of the wiring lines. A semiconductor chip is disposed in the first region and is electrically connected to the respective wiring lines, and a molding member is disposed in the first and second regions and covers the semiconductor chip. |
---|---|
AbstractList | A semiconductor package includes a substrate having a substrate body possessing a first region, a second region which is defined around the first region and a third region which is defined around the second region. Wiring lines are placed on the substrate body, and the wiring lines have first ends that extend to the third region. Connection patterns are placed in the third region and are electrically connected to the first ends of the wiring lines. A semiconductor chip is disposed in the first region and is electrically connected to the respective wiring lines, and a molding member is disposed in the first and second regions and covers the semiconductor chip. |
Author | KIM JONG HYUN KIM DONG YOU HYUN MOON UN CHA KI BON OH JAE SUNG GWON JIN HO |
Author_xml | – fullname: CHA KI BON – fullname: OH JAE SUNG – fullname: KIM DONG YOU – fullname: GWON JIN HO – fullname: HYUN MOON UN – fullname: KIM JONG HYUN |
BookMark | eNrjYmDJy89L5WRwD07NzUzOz0spTS7JL1IoSEzOTkxPVUjMS1EoLgFyUoE0VhUZiWWZeekKJRmpCsWJuak8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61GKgrNS-1JD402MLI0tLU0tDJyJgIJQBJXTXA |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
ExternalDocumentID | US8299591B2 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US8299591B23 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 15:24:37 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US8299591B23 |
Notes | Application Number: US20080347005 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20121030&DB=EPODOC&CC=US&NR=8299591B2 |
ParticipantIDs | epo_espacenet_US8299591B2 |
PublicationCentury | 2000 |
PublicationDate | 20121030 |
PublicationDateYYYYMMDD | 2012-10-30 |
PublicationDate_xml | – month: 10 year: 2012 text: 20121030 day: 30 |
PublicationDecade | 2010 |
PublicationYear | 2012 |
RelatedCompanies | KIM JONG HYUN HYNIX SEMICONDUCTOR INC KIM DONG YOU HYUN MOON UN CHA KI BON OH JAE SUNG GWON JIN HO |
RelatedCompanies_xml | – name: GWON JIN HO – name: KIM JONG HYUN – name: OH JAE SUNG – name: KIM DONG YOU – name: HYUN MOON UN – name: HYNIX SEMICONDUCTOR INC – name: CHA KI BON |
Score | 2.857761 |
Snippet | A semiconductor package includes a substrate having a substrate body possessing a first region, a second region which is defined around the first region and a... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | Semiconductor package and stacked semiconductor package having the same |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20121030&DB=EPODOC&locale=&CC=US&NR=8299591B2 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5KFfWmVbG-2IPkFuw2aRIPQcijFqEPTCO9lWy6KUXclCbi33cmpNWDetpld1lmB76Z2cd8C3AnJPGqZVwXomvpZsYdPXkwuZ5KbiHOBcbQlO88HFmD2Hye9WYNWG1zYSqe0M-KHBERlSLey8per78PsYLqbWVxL1bYlD_2p26g1btjYsMyOlrgueFkHIx9zffdONJGL67TJWIt7qG13qMommj2w1ePklLWPz1K_xj2JziZKk-gIVULDv3tx2stOBjW991YraFXnMJTRM_Yc0X8rPmGodRvaApYohYMAzzEIpa_jqA0fLVkGOixInmXZ8D64dQf6CjRfLf6eRztZDfOoalyJS-ALdIss20rS8yeMBNuOYYwTGnTLZwgAps2tP-c5vKfvis4IjVW1rlzDc1y8yFv0O2W4rZS2BcaCYjL |
link.rule.ids | 230,309,786,891,25594,76906 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8QNOKbokb87IPZ2yJjY8OHxWQbcyobRMDwRtbREWLsCMz473u3DPRBfWrTNs31kt_d9eN-BbjhgnjVUk3lvGWqRqp11PjO0NREaCbinGMMTfnOYWQGY-Np0p5UYLHJhSl4Qj8LckREVIJ4zwt7vfw-xPKKt5XrW77ApuzeH9meUu6OiQ1LbyqeY3cHfa_vKq5rj4dK9GJ3WkSspTlorXcsIuelyOnVoaSU5U-P4h_A7gAnk_khVISsQ83dfLxWh72wvO_Gagm99RE8DOkZeyaJnzVbMZT6DU0Bi-WMYYCHWMTy1xGUhi_nDAM9to7fxTEwvztyAxUlmm5XPx0Pt7LrJ1CVmRSnwGZJmlqWmcZGmxuxZnZ0rhvCols4TgQ2DWj8Oc3ZP33XUAtGYW_ae4yez2GfVFpY6uYFVPPVh7hEF5zzq0J5X6jji7g |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Semiconductor+package+and+stacked+semiconductor+package+having+the+same&rft.inventor=CHA+KI+BON&rft.inventor=OH+JAE+SUNG&rft.inventor=KIM+DONG+YOU&rft.inventor=GWON+JIN+HO&rft.inventor=HYUN+MOON+UN&rft.inventor=KIM+JONG+HYUN&rft.date=2012-10-30&rft.externalDBID=B2&rft.externalDocID=US8299591B2 |