Circuit with high-density capacitors using bootstrapped non-metal layer

A switched-capacitor circuit on a semiconductor device may include accurately matched, high-density metal-to-metal capacitors, using top-plate-to-bottom-plate fringe-capacitance for obtaining the desired capacitance values. A polysilicon plate may be inserted below the bottom metal layer, and bootst...

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Bibliographic Details
Main Author MCLEOD SCOTT C
Format Patent
LanguageEnglish
Published 30.10.2012
Subjects
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