Work function adjustment in high-k metal gate electrode structures by selectively removing a barrier layer

In a replacement gate approach in sophisticated semiconductor devices, a tantalum nitride etch stop material may be efficiently removed on the basis of a wet chemical etch recipe using ammonium hydroxide. Consequently, a further work function adjusting material may be formed with superior uniformity...

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Bibliographic Details
Main Authors LENSKI MARKUS, BINDER ROBERT, METZGER JOACHIM, HEMPEL KLAUS, SCHROEDER VIVIEN
Format Patent
LanguageEnglish
Published 30.10.2012
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Summary:In a replacement gate approach in sophisticated semiconductor devices, a tantalum nitride etch stop material may be efficiently removed on the basis of a wet chemical etch recipe using ammonium hydroxide. Consequently, a further work function adjusting material may be formed with superior uniformity, while the efficiency of the subsequent adjusting of the work function may also be increased. Thus, superior uniformity, i.e., less pronounced transistor variability, may be accomplished on the basis of a replacement gate approach in which the work function of the gate electrodes of P-channel transistors and N-channel transistors is adjusted after completing the basic transistor configuration.
Bibliography:Application Number: US20100785185