Semiconductor package and multichip arrangement having a polymer layer and an encapsulant

• Main Authors: MEYER THORSTEN, SEZI RECAI
• Format: Patent
• Language: English
• Published: 04.09.2012
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A polymer layer is generated on a wafer. The wafer is then separated into semiconductor chips. At least two semiconductor chips are placed on a carrier with the polymer layer facing the carrier. The at least two semiconductor chips are covered with an encapsulating material to form an encapsulant. T...