Input/output package architectures

A high-speed I/O trace is part of an I/O package architecture for an integrated circuit package substrate. The integrated circuit package substrate includes an integrated heat spreader footprint on a die-side and the I/O trace to couple with an IC device to be disposed inside the IHS footprint. The...

Full description

Saved in:
Bibliographic Details
Main Authors GANESAN SANKA, BRAUNISCH HENNING, AYGUN KEMAL, RAMASWAMY CHANDRASHEKHAR, PALMER ERIC
Format Patent
LanguageEnglish
Published 29.05.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

Abstract A high-speed I/O trace is part of an I/O package architecture for an integrated circuit package substrate. The integrated circuit package substrate includes an integrated heat spreader footprint on a die-side and the I/O trace to couple with an IC device to be disposed inside the IHS footprint. The I/O trace includes a pin-out terminal outside the IHS footprint to couple to an IC device to be disposed outside the IHS footprint. The high-speed I/O trace can sustain a data flow rate from a processor in a range from 5 gigabits per second (Gb/s) to 40 Gb/s.
AbstractList A high-speed I/O trace is part of an I/O package architecture for an integrated circuit package substrate. The integrated circuit package substrate includes an integrated heat spreader footprint on a die-side and the I/O trace to couple with an IC device to be disposed inside the IHS footprint. The I/O trace includes a pin-out terminal outside the IHS footprint to couple to an IC device to be disposed outside the IHS footprint. The high-speed I/O trace can sustain a data flow rate from a processor in a range from 5 gigabits per second (Gb/s) to 40 Gb/s.
Author RAMASWAMY CHANDRASHEKHAR
BRAUNISCH HENNING
GANESAN SANKA
AYGUN KEMAL
PALMER ERIC
Author_xml – fullname: GANESAN SANKA
– fullname: BRAUNISCH HENNING
– fullname: AYGUN KEMAL
– fullname: RAMASWAMY CHANDRASHEKHAR
– fullname: PALMER ERIC
BookMark eNrjYmDJy89L5WRQ8swrKC3Rzy8tAVIKBYnJ2YnpqQqJRckZmSWpySWlRanFPAysaYk5xam8UJqbQcHNNcTZQze1ID8-tRioJzUvtSQ-NNjC0MLC1NLEyciYCCUAecwoIQ
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US8188594B2
GroupedDBID EVB
ID FETCH-epo_espacenet_US8188594B23
IEDL.DBID EVB
IngestDate Fri Jul 19 12:49:29 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US8188594B23
Notes Application Number: US20090587175
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120529&DB=EPODOC&CC=US&NR=8188594B2
ParticipantIDs epo_espacenet_US8188594B2
PublicationCentury 2000
PublicationDate 20120529
PublicationDateYYYYMMDD 2012-05-29
PublicationDate_xml – month: 05
  year: 2012
  text: 20120529
  day: 29
PublicationDecade 2010
PublicationYear 2012
RelatedCompanies RAMASWAMY CHANDRASHEKHAR
BRAUNISCH HENNING
INTEL CORPORATION
GANESAN SANKA
AYGUN KEMAL
PALMER ERIC
RelatedCompanies_xml – name: GANESAN SANKA
– name: AYGUN KEMAL
– name: RAMASWAMY CHANDRASHEKHAR
– name: PALMER ERIC
– name: INTEL CORPORATION
– name: BRAUNISCH HENNING
Score 2.8490078
Snippet A high-speed I/O trace is part of an I/O package architecture for an integrated circuit package substrate. The integrated circuit package substrate includes an...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Input/output package architectures
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120529&DB=EPODOC&locale=&CC=US&NR=8188594B2
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQMQWfQZ6YomuSmJKqa2JpmKabaJSSCMx4xsDS0NQw0QR8a4mvn5lHqIlXhGkEE0MmbC8M-JzQcvDhiMAclQzM7yXg8roAMYjlAl5bWayflAkUyrd3C7F1UYP2jg2NQBNXai5Otq4B_i7-zmrOzrahwWp-QbbAesnC1NLECVhaswJb0eagzOAa5gTalFKAXKO4CTKwBQANyysRYmBKzRNm4HSGXbwmzMDhC53vBjKhWa9YhEHJM6-gtEQ_v7QESCkAHZ0NLAkUkOcBikUZFNxcQ5w9dIGWxcM9Fh8aDHeWsRgDC7C_nyrBoGBommpilJSclJxiYWlibpZsaWKSCDrmL8XcOAXYQbOUZJDEaYwUHjlpBi5QCIGmvo0sZRhYSopKU2WBNWpJkhw4LAC26XpY
link.rule.ids 230,309,783,888,25576,76876
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQMQWfQZ6YomuSmJKqa2JpmKabaJSSCMx4xsDS0NQw0QR8a4mvn5lHqIlXhGkEE0MmbC8M-JzQcvDhiMAclQzM7yXg8roAMYjlAl5bWayflAkUyrd3C7F1UYP2jg2NQBNXai5Otq4B_i7-zmrOzrahwWp-QbbAesnC1NLECVhaswJb2OagzOAa5gTalFKAXKO4CTKwBQANyysRYmBKzRNm4HSGXbwmzMDhC53vBjKhWa9YhEHJM6-gtEQ_v7QESCkAHZ0NLAkUkOcBikUZFNxcQ5w9dIGWxcM9Fh8aDHeWsRgDC7C_nyrBoGBommpilJSclJxiYWlibpZsaWKSCDrmL8XcOAXYQbOUZJDEaYwUHjl5Bk6PEF-feB9PP29pBi5QaIGmwY0sZRhYSopKU2WBtWtJkhw4XACeIX1L
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Input%2Foutput+package+architectures&rft.inventor=GANESAN+SANKA&rft.inventor=BRAUNISCH+HENNING&rft.inventor=AYGUN+KEMAL&rft.inventor=RAMASWAMY+CHANDRASHEKHAR&rft.inventor=PALMER+ERIC&rft.date=2012-05-29&rft.externalDBID=B2&rft.externalDocID=US8188594B2