Methods of forming semiconductor devices
Provided are a semiconductor device and a method of forming the same. The method may include forming a metal oxide layer on a substrate and forming a sacrificial oxide layer on the metal oxide layer. An annealing process is performed on the substrate. A formation-free energy of the sacrificial oxide...
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Main Authors | , , , , , , , , , |
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Format | Patent |
Language | English |
Published |
22.05.2012
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Subjects | |
Online Access | Get full text |
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Abstract | Provided are a semiconductor device and a method of forming the same. The method may include forming a metal oxide layer on a substrate and forming a sacrificial oxide layer on the metal oxide layer. An annealing process is performed on the substrate. A formation-free energy of the sacrificial oxide layer is greater than a formation-free energy of the metal oxide layer at a process temperature of the annealing process. |
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AbstractList | Provided are a semiconductor device and a method of forming the same. The method may include forming a metal oxide layer on a substrate and forming a sacrificial oxide layer on the metal oxide layer. An annealing process is performed on the substrate. A formation-free energy of the sacrificial oxide layer is greater than a formation-free energy of the metal oxide layer at a process temperature of the annealing process. |
Author | NA HOONJOO PARK JUN-WOONG HYUN SANGJIN LEE HYE-LAN LEE HYOSAN CHOI SIYOUNG SEO KANG-ILL CHO HAGJU HONG HYUNG-SEOK SHIN YUGYUN |
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RelatedCompanies | NA HOONJOO PARK JUN-WOONG HYUN SANGJIN LEE HYE-LAN LEE HYOSAN CHOI SIYOUNG SEO KANG-ILL CHO HAGJU HONG HYUNG-SEOK SHIN YUGYUN SAMSUNG ELECTRONICS CO., LTD |
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Snippet | Provided are a semiconductor device and a method of forming the same. The method may include forming a metal oxide layer on a substrate and forming a... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | Methods of forming semiconductor devices |
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