Thermally enhanced single inline package (SIP)
In a method and system for fabricating a thermally enhanced semiconductor device (200, 300) is packaged as a through hole single inline package (SIP). A leadframe (210, 310, 410) having a die pad (220, 320, 420) to attach an IC die (230, 330), a first plurality of conductive leads (240, 340, 430) fo...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English |
Published |
08.11.2011
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!