Thermally enhanced single inline package (SIP)
In a method and system for fabricating a thermally enhanced semiconductor device (200, 300) is packaged as a through hole single inline package (SIP). A leadframe (210, 310, 410) having a die pad (220, 320, 420) to attach an IC die (230, 330), a first plurality of conductive leads (240, 340, 430) fo...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English |
Published |
08.11.2011
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | In a method and system for fabricating a thermally enhanced semiconductor device (200, 300) is packaged as a through hole single inline package (SIP). A leadframe (210, 310, 410) having a die pad (220, 320, 420) to attach an IC die (230, 330), a first plurality of conductive leads (240, 340, 430) formed from a first portion of metal sheet (432), and a second portion of metal sheet (440) disposed on an opposite side of the IC die (230, 330) as the first plurality of conductive leads is stamped from a metal sheet. The first plurality of conductive leads (240, 340, 430) are arranged in a single line and are capable of being through hole mounted in accordance with the SIP. The second portion of metal sheet (440) includes the die pad (420) to form a heat spreader (260, 360) in the form of the metal sheet. The heat spreader (260, 360) provides heat dissipating for the heat generated by the IC die (230, 330). |
---|---|
AbstractList | In a method and system for fabricating a thermally enhanced semiconductor device (200, 300) is packaged as a through hole single inline package (SIP). A leadframe (210, 310, 410) having a die pad (220, 320, 420) to attach an IC die (230, 330), a first plurality of conductive leads (240, 340, 430) formed from a first portion of metal sheet (432), and a second portion of metal sheet (440) disposed on an opposite side of the IC die (230, 330) as the first plurality of conductive leads is stamped from a metal sheet. The first plurality of conductive leads (240, 340, 430) are arranged in a single line and are capable of being through hole mounted in accordance with the SIP. The second portion of metal sheet (440) includes the die pad (420) to form a heat spreader (260, 360) in the form of the metal sheet. The heat spreader (260, 360) provides heat dissipating for the heat generated by the IC die (230, 330). |
Author | COYLE ANTHONY L BOYD WILLIAM D HAGA CHRIS E |
Author_xml | – fullname: BOYD WILLIAM D – fullname: COYLE ANTHONY L – fullname: HAGA CHRIS E |
BookMark | eNrjYmDJy89L5WTQC8lILcpNzMmpVEjNy0jMS05NUSjOzEvPSVXIzMvJzEtVKEhMzk5MT1XQCPYM0ORhYE1LzClO5YXS3AwKbq4hzh66qQX58anFQLWpeakl8aHBFgamxkYWpk5GxkQoAQBSyis1 |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
ExternalDocumentID | US8053285B2 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US8053285B23 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 15:15:06 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US8053285B23 |
Notes | Application Number: US20090565976 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111108&DB=EPODOC&CC=US&NR=8053285B2 |
ParticipantIDs | epo_espacenet_US8053285B2 |
PublicationCentury | 2000 |
PublicationDate | 20111108 |
PublicationDateYYYYMMDD | 2011-11-08 |
PublicationDate_xml | – month: 11 year: 2011 text: 20111108 day: 08 |
PublicationDecade | 2010 |
PublicationYear | 2011 |
RelatedCompanies | TEXAS INSTRUMENTS INCORPORATED |
RelatedCompanies_xml | – name: TEXAS INSTRUMENTS INCORPORATED |
Score | 2.8322062 |
Snippet | In a method and system for fabricating a thermally enhanced semiconductor device (200, 300) is packaged as a through hole single inline package (SIP). A... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | Thermally enhanced single inline package (SIP) |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111108&DB=EPODOC&locale=&CC=US&NR=8053285B2 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFPVNp-L8Ig9S9KF-rFmND0XoF1NwK3aVvY3EJlgsdbiK-N97Cev0Rd9CApcv7i73kd8BnLhM4aM4p7YrLrlN-RW1uUYc4qqnnPyG6RpyOtti6A4yej_pT1pQNH9hDE7opwFHRI56Rn6vjbye_TixQpNbOb8QBXa93cZjL7Tyxt2ns9qt0PeiZBSOAisIvCy1ho8e0xUQWN9Hab2iX9EaZj968vWnlNlvjRJvwmqCxKp6C1qy6sB60BRe68DawyLejc0F68234RwvFIVoWX4RWb2YuD3Rdn4pSWHQLghu5BWlAzlN75KzHSBxNA4GNk48XW5ymqXLJTq70EbbX-4BYdccbTahVO4wqmgulBRMMNpTlKPull3o_klm_5-xA9gwzlHjHz2Edv3-IY9Qu9bi2JzLN9R8fkg |
link.rule.ids | 230,309,786,891,25594,76903 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQMbNIAzaKU0x0zZIMEnVNEg1NdBNBJw4lphmlGadYWoDukAOttvAz8wg18YowjWBiyITthQGfE1oOPhwRmKOSgfm9BFxeFyAGsVzAayuL9ZMygUL59m4hti5qKbDhPtCqdjUXJ1vXAH8Xf2c1Z2fb0GA1vyBbC9ANCBamTsDSmtUc2CME95TCnECbUgqQaxQ3QQa2AKBheSVCDEypecIMnM6wi9eEGTh8ofPdQCY06xWLMOgBIxRYiObkVCqk5mWA5-0VQP38nFSFTPBpFwpAj2QDSwcFjWDPAE1RBgU31xBnD12gxfFwT8aHBsOdaCzGwALs-6dKMChYmCcC-2xJaWkpxhYmaSYpSWmpSRZJFiZGaSaJwLo7VZJBEqcxUnjk5Bk4PUJ8feJ9PP28pRm4wAOl4LFSGQaWkqLSVFlgTVuSJAcOIwDhKoEy |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Thermally+enhanced+single+inline+package+%28SIP%29&rft.inventor=BOYD+WILLIAM+D&rft.inventor=COYLE+ANTHONY+L&rft.inventor=HAGA+CHRIS+E&rft.date=2011-11-08&rft.externalDBID=B2&rft.externalDocID=US8053285B2 |