Dual hot melt adhesive systems
The present disclosure relates to the use of first and second adhesives for the attachment of zipper flanges to reclosable packages. A first adhesive is typically a reactive, cross-linkable hot melt adhesive while the second adhesive is typically non-cross-linkable hot melt adhesive, typically, but...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
10.05.2011
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Subjects | |
Online Access | Get full text |
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Summary: | The present disclosure relates to the use of first and second adhesives for the attachment of zipper flanges to reclosable packages. A first adhesive is typically a reactive, cross-linkable hot melt adhesive while the second adhesive is typically non-cross-linkable hot melt adhesive, typically, but not limited to, either EVA-based or polyamide-based. Alternatively, the second adhesive can be a coextrusion layer including a resin that is typically used as a sealant layer in zipper extrusion, such as metallocene type linear low density polyethylene. |
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Bibliography: | Application Number: US20080228804 |