Pressure sensor module

A pressure sensor module of the invention includes a pressure sensor and a laminar substrate. Electrodes are arranged in the vicinity of a diaphragm portion of the pressure sensor. In the laminar substrate, a plurality of substrates are laminated, and the laminar substrate incorporates the pressure...

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Bibliographic Details
Main Authors HASHIMOTO MIKIO, YAMAMOTO SATOSHI
Format Patent
LanguageEnglish
Published 14.12.2010
Subjects
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
PHYSICS
TESTING
TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES
TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR
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Summary:A pressure sensor module of the invention includes a pressure sensor and a laminar substrate. Electrodes are arranged in the vicinity of a diaphragm portion of the pressure sensor. In the laminar substrate, a plurality of substrates are laminated, and the laminar substrate incorporates the pressure sensor. One face of the diaphragm portion is exposed by a space portion. According to the invention, it is possible to provide a pressure sensor module which facilitates smaller and thinner sizes, and which enables high-density packaging.
Bibliography:Application Number: US20090473822