Electronic devices with hybrid high-k dielectric and fabrication methods thereof
Electronic devices with hybrid high-k dielectric and fabrication methods thereof. The electronic device includes a substrate. A first electrode is disposed on the substrate. Hybrid high-k multi-layers comprising a first dielectric layer and a second dielectric layer are disposed on the substrate, wh...
Saved in:
Main Authors | , , , , , |
---|---|
Format | Patent |
Language | English |
Published |
30.11.2010
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | Electronic devices with hybrid high-k dielectric and fabrication methods thereof. The electronic device includes a substrate. A first electrode is disposed on the substrate. Hybrid high-k multi-layers comprising a first dielectric layer and a second dielectric layer are disposed on the substrate, wherein the first dielectric layer and the second dielectric layer are solvable and substantially without interface therebetween. A second electrode is formed on the hybrid multi-layers. |
---|---|
Bibliography: | Application Number: US20070849460 |