Integrated circuit having a semiconductor arrangement

An integrated circuit including a semiconductor arrangement, a power semiconductor component and an associated production method is disclosed. One embodiment includes a carrier substrate, a first interconnect layer, formed on the carrier substrate and has at least one cutout, an insulating filling l...

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Main Authors MAIER HUBERT, DETZEL THOMAS, WOEHLERT STEFAN, HOECKELE UWE, SCHREIBER KAI-ALEXANDER
Format Patent
LanguageEnglish
Published 16.11.2010
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Abstract An integrated circuit including a semiconductor arrangement, a power semiconductor component and an associated production method is disclosed. One embodiment includes a carrier substrate, a first interconnect layer, formed on the carrier substrate and has at least one cutout, an insulating filling layer, formed on the first interconnect layer and the carrier substrate and fills at least one cutout, an SiON layer, formed on the filling layer, and a second interconnect layer, formed over the SiON layer.
AbstractList An integrated circuit including a semiconductor arrangement, a power semiconductor component and an associated production method is disclosed. One embodiment includes a carrier substrate, a first interconnect layer, formed on the carrier substrate and has at least one cutout, an insulating filling layer, formed on the first interconnect layer and the carrier substrate and fills at least one cutout, an SiON layer, formed on the filling layer, and a second interconnect layer, formed over the SiON layer.
Author MAIER HUBERT
SCHREIBER KAI-ALEXANDER
DETZEL THOMAS
WOEHLERT STEFAN
HOECKELE UWE
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Snippet An integrated circuit including a semiconductor arrangement, a power semiconductor component and an associated production method is disclosed. One embodiment...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Integrated circuit having a semiconductor arrangement
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