Integrated circuit having a semiconductor arrangement
An integrated circuit including a semiconductor arrangement, a power semiconductor component and an associated production method is disclosed. One embodiment includes a carrier substrate, a first interconnect layer, formed on the carrier substrate and has at least one cutout, an insulating filling l...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
16.11.2010
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Subjects | |
Online Access | Get full text |
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Abstract | An integrated circuit including a semiconductor arrangement, a power semiconductor component and an associated production method is disclosed. One embodiment includes a carrier substrate, a first interconnect layer, formed on the carrier substrate and has at least one cutout, an insulating filling layer, formed on the first interconnect layer and the carrier substrate and fills at least one cutout, an SiON layer, formed on the filling layer, and a second interconnect layer, formed over the SiON layer. |
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AbstractList | An integrated circuit including a semiconductor arrangement, a power semiconductor component and an associated production method is disclosed. One embodiment includes a carrier substrate, a first interconnect layer, formed on the carrier substrate and has at least one cutout, an insulating filling layer, formed on the first interconnect layer and the carrier substrate and fills at least one cutout, an SiON layer, formed on the filling layer, and a second interconnect layer, formed over the SiON layer. |
Author | MAIER HUBERT SCHREIBER KAI-ALEXANDER DETZEL THOMAS WOEHLERT STEFAN HOECKELE UWE |
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RelatedCompanies | INFINEON TECHNOLOGIES AUSTRIA AG |
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Snippet | An integrated circuit including a semiconductor arrangement, a power semiconductor component and an associated production method is disclosed. One embodiment... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | Integrated circuit having a semiconductor arrangement |
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