Dual-stage wafer applied underfills
A 100% non-volatile, one-part liquid underfill encapsulant is disclosed for application to the active side of a large wafer or integrated circuit chip. Upon coating, the encapsulant is converted to a liquefiable, tack-free solid by exposure to radiation, particularly in the UV, visible and infrared...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
14.07.2009
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Subjects | |
Online Access | Get full text |
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