Array quad flat no-lead package and method of forming same

An array QFN package (10) includes a first semiconductor package (12) and a lead frame (14) having a plurality of leads (16). A first IC die (22) is attached on a first side to the first semiconductor package (12) and is electrically connected to the leads (16) of the lead frame (14). A mold compoun...

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Bibliographic Details
Main Authors YIP HENG KEONG, LO WAI YEW
Format Patent
LanguageEnglish
Published 12.05.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An array QFN package (10) includes a first semiconductor package (12) and a lead frame (14) having a plurality of leads (16). A first IC die (22) is attached on a first side to the first semiconductor package (12) and is electrically connected to the leads (16) of the lead frame (14). A mold compound (30) encapsulates the first IC die (22), a portion of the first semiconductor package (12) and a portion of the leads (16) such that a plurality of I/O terminals (32) on the semiconductor package (10) is exposed.
Bibliography:Application Number: US20060554920