Method for controlling thickness uniformity of electroplated layers
An apparatus which can control thickness uniformity during deposition of conductive material from an electrolyte onto a surface of a semiconductor substrate is provided. The apparatus has an anode which can be contacted by the electrolyte during deposition of the conductive material, a cathode assem...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English |
Published |
14.10.2008
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!