Method of packaging semiconductor die without lead frame or substrate

• Main Authors: ISMAIL AMINUDDIN, FOONG CHEE SENG, IBRAHIM RUZAINI
• Format: Patent
• Language: English
• Published: 07.10.2008
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method of packaging a semiconductor die ( 10 ) includes providing a flip-chip die ( 10 ) with bump connections ( 12 ) on its bottom surface ( 14 ). An adhesive tape ( 18 ) is attached to a plate surface ( 16 ) and lead fingers ( 20 ) are formed on the tape ( 18 ). The die ( 10 ) is placed on the tape ( 18 ) such that the bumps ( 12 ) on the die ( 10 ) contact respective ones of the lead fingers ( 20 ) on the tape ( 18 ). A reflow process is performed on the die ( 10 ), the tape ( 18 ) and the plate ( 16 ), which forms C5 type interconnects. A mold compound ( 24 ) is formed over the die ( 10 ) and the tape ( 18 ), and then the tape ( 18 ) and the plate ( 16 ) are removed.