Connection structure for connecting semiconductor element and wiring board, and semiconductor device

In a connection structure of the present invention, the wiring board including a solder resist covering part which covers the wiring pattern with solder resist, the solder resist covering part having a solder resist opening or solder resist openings which expose(s) the wiring board connection termin...

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Bibliographic Details
Main Authors IWANE TOMOHIKO, NAKAMURA NAKAE
Format Patent
LanguageEnglish
Published 02.09.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:In a connection structure of the present invention, the wiring board including a solder resist covering part which covers the wiring pattern with solder resist, the solder resist covering part having a solder resist opening or solder resist openings which expose(s) the wiring board connection terminals therethrough, and the solder resist opening or the solder resist openings surrounding at least one part of the solder resist covering part. Therefore, the wiring patterns are not unnecessarily exposed. That is, without disadvantageous contact between each wiring pattern and the semiconductor element, the semiconductor element can be mounted on the wiring board, and thus, the semiconductor device is reliable.
Bibliography:Application Number: US20050250513