Heat-treating apparatus and heat-treating method

• Main Authors: SHITE HIDEO, SHIZUKUISHI MOMOKO, YOSHIHARA KOUSUKE, OOSHIMA KAZUHIKO, TERASHITA YUICHI
• Format: Patent
• Language: English
• Published: 10.06.2008
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS,IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KINDOF FURNACE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FURNACES; FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; HEATING; KILNS; LIGHTING; MECHANICAL ENGINEERING; OPEN SINTERING OR LIKE APPARATUS; OVENS; RETORTS; SEMICONDUCTOR DEVICES; WEAPONS

A heat-treating apparatus comprises a table having a heating element buried therein, a plate-like target object to be processed being disposed on the table so as to be heated to a prescribed temperature, a support member for supporting the target object and movable in the vertical direction relative to the table such that the support member is moved to permit the target object supported by the support member to be disposed on the table or is moved away from the table, a cover surrounding the upper portion of the table, and a casing surrounding the lower portion of the table and combined with the cover so as to form a process chamber. When the process chamber is opened, the support member permits the target object to be housed inside the cover.