Method of making stacked die package

A method of making a stacked die package ( 39 ) includes placing a first flip chip die ( 16 ) on a base carrier ( 12 ) and electrically connecting the first flip chip die ( 16 ) to the base carrier ( 12 ). A second flip chip die ( 18 ) is attached back-to-back to the first flip chip die ( 16 ) and e...

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Bibliographic Details
Main Author LO WAI YEW
Format Patent
LanguageEnglish
Published 27.05.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract A method of making a stacked die package ( 39 ) includes placing a first flip chip die ( 16 ) on a base carrier ( 12 ) and electrically connecting the first flip chip die ( 16 ) to the base carrier ( 12 ). A second flip chip die ( 18 ) is attached back-to-back to the first flip chip die ( 16 ) and electrically connected to the base carrier ( 12 ) with a plurality of insulated wires ( 20 ). A mold compound ( 36 ) is formed over the first and second dice and one surface of the base carrier.
AbstractList A method of making a stacked die package ( 39 ) includes placing a first flip chip die ( 16 ) on a base carrier ( 12 ) and electrically connecting the first flip chip die ( 16 ) to the base carrier ( 12 ). A second flip chip die ( 18 ) is attached back-to-back to the first flip chip die ( 16 ) and electrically connected to the base carrier ( 12 ) with a plurality of insulated wires ( 20 ). A mold compound ( 36 ) is formed over the first and second dice and one surface of the base carrier.
Author LO WAI YEW
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Snippet A method of making a stacked die package ( 39 ) includes placing a first flip chip die ( 16 ) on a base carrier ( 12 ) and electrically connecting the first...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Method of making stacked die package
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