Dielectric composition for forming dielectric layer for use in circuitized substrates

A dielectric composition which forms a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. As such a layer, it includes a cured resin material and a predetermined percentage by weight of particulate fillers, thus not including continuous fibers, semi-continuou...

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Main Authors PAPATHOMAS KOSTAS, JAPP ROBERT
Format Patent
LanguageEnglish
Published 18.09.2007
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Abstract A dielectric composition which forms a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. As such a layer, it includes a cured resin material and a predetermined percentage by weight of particulate fillers, thus not including continuous fibers, semi-continuous fibers or the like as part thereof.
AbstractList A dielectric composition which forms a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. As such a layer, it includes a cured resin material and a predetermined percentage by weight of particulate fillers, thus not including continuous fibers, semi-continuous fibers or the like as part thereof.
Author PAPATHOMAS KOSTAS
JAPP ROBERT
Author_xml – fullname: PAPATHOMAS KOSTAS
– fullname: JAPP ROBERT
BookMark eNqNi7sKwkAQRbfQwtc_zA8IEpVY-8JeU4d1MpGBZGbZ2S30630g2FpcTnHOHbuBqNDIVXumjjBFRkDtgxonVoFW43s9yw2aX9L5O30EZCNgAeSI-XV5UAOWr5aiT2RTN2x9ZzT7cuLgeLjsTnMKWpMFjySU6upcFuVis1pvi-UfyRMDezuC
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US7270845B2
GroupedDBID EVB
ID FETCH-epo_espacenet_US7270845B23
IEDL.DBID EVB
IngestDate Fri Jul 19 16:05:30 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US7270845B23
Notes Application Number: US20040812889
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070918&DB=EPODOC&CC=US&NR=7270845B2
ParticipantIDs epo_espacenet_US7270845B2
PublicationCentury 2000
PublicationDate 20070918
PublicationDateYYYYMMDD 2007-09-18
PublicationDate_xml – month: 09
  year: 2007
  text: 20070918
  day: 18
PublicationDecade 2000
PublicationYear 2007
RelatedCompanies ENDICOTT INTERCONNECT TECHNOLOGIES, INC
RelatedCompanies_xml – name: ENDICOTT INTERCONNECT TECHNOLOGIES, INC
Score 2.688628
Snippet A dielectric composition which forms a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. As such a layer, it includes...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
CONDUCTORS
ELECTRIC INCANDESCENT LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Title Dielectric composition for forming dielectric layer for use in circuitized substrates
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070918&DB=EPODOC&locale=&CC=US&NR=7270845B2
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5KFfWmVbG-2IPkFoxtkiaHIDQPitAHtpHeSvYRWKhpaRIEf72Tbdp60cPCsi92F2a-2dl5ADxZXe6KNEl1WxiJbvY6VKfCYbpLBYJzl3NTqbKHI3sQm29za94AufOFUXFCv1RwRKQohvReKH69PiixAmVbmT9TiU2r12jmBdruddxD-HO0oO-Fk3Ew9jXf9-KpNnr3EKYNx7T6yK2PKim6CrMffvQrp5T1b0SJzuF4gotlxQU0RNaCU3-XeK0FJ8P6vxurNenllxAHcpuyRjJS2YHXxlYEhc6qfCIEEX4YskxQlladZS6IzAiTG1bilG_BSY7cQkWlza-AROHMH-i4v8X-LhbxdH-S7jU0s1UmboDYKLlwU1DmssRMLUQY0aGdlFrcEFW2tja0_1zm9p--Ozjb6jJd_cW5h2axKcUDgnBBH9X1_QCdK48X
link.rule.ids 230,309,786,891,25594,76904
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5KFetNq2J97kFyC9Y2SZNDEJK0VO0L20hvJfsIBGpamgTBX-9km7Re9LCw7IvdhZlvdnYeAA96m1siDELVEM1A1TotqlJhMtWiAsG5zbkmVdnDkdH3tde5Pq9AVPrCyDihXzI4IlIUQ3pPJb9e75VYnrStTB5phE2r597M9pTyddxB-DMVz7G7k7E3dhXXtf2pMnq3EaabpqY7yK0POvgizMPsdz-c3Cll_RtReidwOMHF4vQUKiKuQ80tE6_V4WhY_HdjtSC95Ax8L9qmrIkYye3AC2MrgkJnXj4RggjfD1kGKEvLziwRJIoJizYswynfgpMEuYWMSpucA-l1Z25fxf0tdnex8Ke7k7QvoBqvYnEJxEDJhWuCMosFWqgjwogWbYVU502RZ2trQOPPZa7-6buHWn82HCwGL6O3azje6jUt9cm8gWq6ycQtAnJK7-RV_gB0UpIC
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Dielectric+composition+for+forming+dielectric+layer+for+use+in+circuitized+substrates&rft.inventor=PAPATHOMAS+KOSTAS&rft.inventor=JAPP+ROBERT&rft.date=2007-09-18&rft.externalDBID=B2&rft.externalDocID=US7270845B2