Bond capillary design for ribbon wire bonding

• Main Authors: LANGE BERNHARD P, KUMMERL STEVEN ALFRED
• Format: Patent
• Language: English
• Published: 15.05.2007
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A device ( 100 ) and method ( 200 ) for bonding a ribbon wire ( 104 ) to a workpiece ( 106 ) comprising feeding the ribbon wire through a passageway ( 116 ) of an ultrasonic bond capillary ( 102 ) and clamping the ribbon wire against an engagement surface ( 120 ) of the bond capillary via a clamping jaw ( 118 ) operably coupled to the bond capillary. The ribbon wire ( 104 ) is bonded to the workpiece ( 106 ) along a bonding surface ( 112 ) of the bond capillary ( 102 ) and penetrated, at least partially, between the bonding surface and the engagement surface ( 120 ) of the bond capillary by a cutting tool ( 124 ). The cutting tool ( 124 ) may comprise an elongate member ( 126 ) positioned between the bonding surface ( 112 ) and engagement surface ( 120 ), and may have a cutting blade ( 128 ) positioned at a distal end ( 130 ) thereof. The cutting tool ( 124 ) may further comprise a ring cutter ( 132 ), wherein the ribbon wire passes through a ring ( 134 ) having a cutting surface ( 138 ) defined about an inner diameter thereof.