Apparatus for cooling semiconductor devices attached to a printed circuit board
An electronic assembly includes a semiconductor device mounted on a printed circuit board, a leaf spring and a cooling plate. A plurality of fasteners pass through co-axial apertures of the leaf spring, the printed circuit board and the cooling plate, such that a contact surface of the leaf spring i...
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| Main Author | |
|---|---|
| Format | Patent |
| Language | English |
| Published |
06.03.2007
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| Subjects | |
| Online Access | Get full text |
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| Abstract | An electronic assembly includes a semiconductor device mounted on a printed circuit board, a leaf spring and a cooling plate. A plurality of fasteners pass through co-axial apertures of the leaf spring, the printed circuit board and the cooling plate, such that a contact surface of the leaf spring imparts a force on the semiconductor device to retain the semiconductor device in a thermally conductive position with respect to the cooling plate. A positive cooling effect is achieved regardless of mounting conditions including orientation of the electronic assembly, and the position of the semiconductor device on the cooling plate. |
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| AbstractList | An electronic assembly includes a semiconductor device mounted on a printed circuit board, a leaf spring and a cooling plate. A plurality of fasteners pass through co-axial apertures of the leaf spring, the printed circuit board and the cooling plate, such that a contact surface of the leaf spring imparts a force on the semiconductor device to retain the semiconductor device in a thermally conductive position with respect to the cooling plate. A positive cooling effect is achieved regardless of mounting conditions including orientation of the electronic assembly, and the position of the semiconductor device on the cooling plate. |
| Author | SCHMIDBERGER STEFAN |
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| Notes | Application Number: US20040914624 |
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| PublicationDateYYYYMMDD | 2007-03-06 |
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| RelatedCompanies | HARMAN BECKER AUTOMOTIVE SYSTEMS GMBH |
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| Snippet | An electronic assembly includes a semiconductor device mounted on a printed circuit board, a leaf spring and a cooling plate. A plurality of fasteners pass... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| Title | Apparatus for cooling semiconductor devices attached to a printed circuit board |
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