Cooling system for an electronic component
A cooling system for an electronic component is provided. The cooling system includes a plurality of thermoelectric elements for placement above a plurality of different areas of the electronic component. The cooling system has a plurality of conductors connected to the thermoelectric elements for p...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
19.04.2005
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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