Method of producing a capacitor electrode with a barrier structure

A capacitor electrode is produced with an underlying barrier structure. A barrier incorporation layer is used and a CMP (chemical mechanical polishing) process is employed in order to produce the barrier structure. The capacitor electrode with an underlying barrier structure is produced by depositin...

Full description

Saved in:
Bibliographic Details
Main Authors KASKO IGOR, SAENGER ANNETTE, BEITEL GERHARD
Format Patent
LanguageEnglish
Published 03.02.2004
Edition7
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A capacitor electrode is produced with an underlying barrier structure. A barrier incorporation layer is used and a CMP (chemical mechanical polishing) process is employed in order to produce the barrier structure. The capacitor electrode with an underlying barrier structure is produced by depositing a barrier layer on a semiconductor substrate; forming a barrier structure from the barrier layer with a lithographic mask and an etching step; depositing a barrier incorporation layer covering the barrier structure and surrounding regions; and removing the barrier incorporation layer with chemical mechanical polishing until the barrier structure is uncovered, to thereby form the capacitor electrode above the barrier structure.
Bibliography:Application Number: US20020127618