Method to form a color image sensor cell while protecting the bonding pad structure from damage

• Main Authors: CHU CHENG-YU, FAN YANG-TUNG, PENG CHIOU-SHIAN, LIN SHIH-JANE, CHEN YEN-MING, LIN KUO-WEI, FAN FU-JIER
• Format: Patent
• Language: English
• Published: 14.10.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A new method to form color image sensor cells without damaging bonding pads in the manufacture of an integrated circuit device is achieved. The method comprises, first, forming cell electrodes and bonding pads on a semiconductor substrate. A passivation layer is formed overlying the cell electrodes...