Temperature control method of solder bumps in reflow furnace, and reflow furnace

• Main Author: YAMAOKA NOBUYOSHI
• Format: Patent
• Language: English
• Published: 16.09.2003
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CONTROLLING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PHYSICS; PRINTED CIRCUITS; REGULATING; SOLDERING OR UNSOLDERING; SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A method for determining the condition of a reflow furnace so as to prevent the semiconductor element from tilting due to different collapsed amounts of solder bumps in the single semiconductor element of multiple chip modules mounted on the semiconductor element on the substrate. For the carrying d...