Pattern formation material and method
In the pattern formation method of this invention, a resist film is formed by applying, on a substrate, a pattern formation material containing a polymer including a first unit represented by Chemical Formula 1 and a second unit represented by Chemical Formula 2, and an acid generator,wherein R1 and...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
10.06.2003
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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