Ceramic waferboard for integration of optical/optoelectronic/electronic components

An optoelectronic module includes a ceramic waferboard having a groove configured to passively position an optical fiber. The ceramic waferboard includes an alignment feature configured to passively position an optical component. An optical device is secured to the ceramic waferboard in contact with...

Full description

Saved in:
Bibliographic Details
Main Authors BOUDREAU ROBERT A, TAN SONGSHENG
Format Patent
LanguageEnglish
Published 03.06.2003
Edition7
Subjects
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
Online AccessGet full text

Cover

Abstract An optoelectronic module includes a ceramic waferboard having a groove configured to passively position an optical fiber. The ceramic waferboard includes an alignment feature configured to passively position an optical component. An optical device is secured to the ceramic waferboard in contact with the alignment feature to thereby position the optical device. An optical fiber is positioned in the groove with an end of the optical fiber positioned adjacent the optical device to thereby optically couple the optical fiber to the optical device. The optoelectronic module also includes an integrated circuit chip secured to the ceramic waferboard, and a conductive material disposed on the ceramic waferboard and electrically coupling the integrated circuit chip to the optical device.
AbstractList An optoelectronic module includes a ceramic waferboard having a groove configured to passively position an optical fiber. The ceramic waferboard includes an alignment feature configured to passively position an optical component. An optical device is secured to the ceramic waferboard in contact with the alignment feature to thereby position the optical device. An optical fiber is positioned in the groove with an end of the optical fiber positioned adjacent the optical device to thereby optically couple the optical fiber to the optical device. The optoelectronic module also includes an integrated circuit chip secured to the ceramic waferboard, and a conductive material disposed on the ceramic waferboard and electrically coupling the integrated circuit chip to the optical device.
Author TAN SONGSHENG
BOUDREAU ROBERT A
Author_xml – fullname: BOUDREAU ROBERT A
– fullname: TAN SONGSHENG
BookMark eNqNjLsKwkAQAK_Qwtc_7A9IwPggrUGx9lGH9bInB5fdY2_B3zeFYGs1UwwzdxMWppm7tqQ4RA9vDKRPQe0hiEJko5eiRWGQAJItekzVSKFE3lQ4-uqn4GXI45GtLN00YCq0-nLh4Hy6t5c1ZemoZPTEZN3jtt8dtnXTHDf1H8kHW-060g
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
Physics
Edition 7
ExternalDocumentID US6574399B2
GroupedDBID EVB
ID FETCH-epo_espacenet_US6574399B23
IEDL.DBID EVB
IngestDate Fri Jul 19 11:47:19 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US6574399B23
Notes Application Number: US20010015914
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030603&DB=EPODOC&CC=US&NR=6574399B2
ParticipantIDs epo_espacenet_US6574399B2
PublicationCentury 2000
PublicationDate 20030603
PublicationDateYYYYMMDD 2003-06-03
PublicationDate_xml – month: 06
  year: 2003
  text: 20030603
  day: 03
PublicationDecade 2000
PublicationYear 2003
RelatedCompanies CORNING INCORPORATED
RelatedCompanies_xml – name: CORNING INCORPORATED
Score 2.570662
Snippet An optoelectronic module includes a ceramic waferboard having a groove configured to passively position an optical fiber. The ceramic waferboard includes an...
SourceID epo
SourceType Open Access Repository
SubjectTerms OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
Title Ceramic waferboard for integration of optical/optoelectronic/electronic components
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030603&DB=EPODOC&locale=&CC=US&NR=6574399B2
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1La4NAEB5C-ry1tiXpiz0UbxJZsxoPUvBFKORBEktuQTcKuahES_5-Z7cx9tLelllZ1pHZ-Wb9ZgbgbcS33KQW1WKMJ7ShlTINUZGtsdGWCX9p6YnId55MzXE0_FizdQd2TS6MrBN6kMUR0aI42nstz-uyvcTyJbeyGiQ7FBXv4crx1SY6RgCsG6rvOsF85s881fOcaKlOF47JJPJ28bQ-QxRtCfZX8OmKpJTyt0cJb-B8jovl9S100lyBK69pvKbA5eT4v1uBC0nQ5BUKj0ZY3cHCS_eiizw5xBkqpcBvTBB6kqbyA26eFBkpSnlNjVFxXbTNbgbtkAg6eZELJsU9kDBYeWMNt7k5qWQTLU8vZDxAN8eHe0Asg2Y2w4DLFnX_7NS2ODUTM9MZo5zyuA_9P5d5_GfuCa7pT9dBTTeeoVvvv9IX9MV18iq1-A0UKY95
link.rule.ids 230,309,783,888,25578,76884
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1Lb8IwDLYQe7Db1m2CPXOYequoUtLHoZrUFsQ2WhCPiRuioZW4tIh24u_PySjsst2qNIoSR44_J_ZngBebr7hJLaot0Z_QOlbCNERFjsbsFRP20tJjke8cRmZ_1nmfs3kN1lUujOQJ3UlyRNQojvpeyvN6c7zECmRsZdGO19iUv_ambqBW3jECYN1QA8_tjobB0Fd9351N1Gjsmkwibw9P6xNE2Lag2e9-eiIpZfPbovQu4XSEg2XlFdSSTIGGXxVeU-A83L93K3AmAzR5gY17JSyuYewnW1FFnuyWKQolxz0mCD1JxfyAkyd5SvKNvKZGr7jMj8Vu2sdPIsLJ80xEUtwA6XWnfl_DaS4OIlnMJocFGbdQz7BzE4hl0NRh6HA5gvfPSRyLUzM2U50xyilftqD15zB3__x7hkZ_Gg4Wg7fo4x4u6E8FQk03HqBebr-SR7TLZfwkJfoN90GSaQ
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Ceramic+waferboard+for+integration+of+optical%2Foptoelectronic%2Felectronic+components&rft.inventor=BOUDREAU+ROBERT+A&rft.inventor=TAN+SONGSHENG&rft.date=2003-06-03&rft.externalDBID=B2&rft.externalDocID=US6574399B2