Ingot support device for slicing silicon

An ingot support device for slicing silicon is produced by molding a molding material obtained by blending an acrylic resin or an unsaturated polyester resin and one or more inorganic fillers selected from the group consisting of aluminium hydroxide, barium sulphate, barium carbonate, calcium carbon...

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Bibliographic Details
Main Authors HONMA HIDEKI, KANEKO KATSUAKI
Format Patent
LanguageEnglish
Published 25.12.2001
Edition7
Subjects
PERFORMING OPERATIONS
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Summary:An ingot support device for slicing silicon is produced by molding a molding material obtained by blending an acrylic resin or an unsaturated polyester resin and one or more inorganic fillers selected from the group consisting of aluminium hydroxide, barium sulphate, barium carbonate, calcium carbonate and silica. According to the present invention, there is provided an ingot support device for slicing silicon which can be produced easily at a low cost, which has enough strength to cope with the upsizing of the ingot block, has high adhesive properties with the ingot block, and has other further improved properties which are required of the ingot support device for slicing silicon.
Bibliography:Application Number: US19990264236