Tin-indium alloy electroplating solution

• Main Authors: TAMURA TAKAAKI, TSUNODA KYOKO
• Format: Patent
• Language: English
• Published: 18.12.2001
• Edition: 7
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

A tin/indium alloy plating solution not containing any cyanide and serving as a substitute for tin/lead alloy plating is provided. The tin/indium alloy plating solution is a weakly alkaline aqueous solution for tin/indium alloy electroplating, prepared by adding, as metal salts, a tetravalent tin sa...