Method to remove metals in a scrubber
A method to remove metal contaminants in a substrate cleaning process. The present invention may replace or be used in conjunction with other substrate cleaning systems. This method comprises adding a citric acid solution to the liquid medium of a semiconductor substrate cleaning system. This method...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
14.08.2001
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| Edition | 7 |
| Subjects | |
| Online Access | Get full text |
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| Abstract | A method to remove metal contaminants in a substrate cleaning process. The present invention may replace or be used in conjunction with other substrate cleaning systems. This method comprises adding a citric acid solution to the liquid medium of a semiconductor substrate cleaning system. This method is described in the manner it is used in conjunction with a scrubber wherein both sides of a wafer are scrubbed. |
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| AbstractList | A method to remove metal contaminants in a substrate cleaning process. The present invention may replace or be used in conjunction with other substrate cleaning systems. This method comprises adding a citric acid solution to the liquid medium of a semiconductor substrate cleaning system. This method is described in the manner it is used in conjunction with a scrubber wherein both sides of a wafer are scrubbed. |
| Author | MALIK IGOR J KRUSELL WILBUR C |
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| Notes | Application Number: US19960615520 |
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| PublicationDateYYYYMMDD | 2001-08-14 |
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| RelatedCompanies | LAM RESEARCH CORPORATION |
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| Snippet | A method to remove metal contaminants in a substrate cleaning process. The present invention may replace or be used in conjunction with other substrate... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING |
| Title | Method to remove metals in a scrubber |
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