Copper alloy having improved resistance to cracking due to localized stress

• Main Authors: BREEDIS JOHN F, MANDIGO FRANK N
• Format: Patent
• Language: English
• Published: 26.06.2001
• Edition: 7
• Subjects: ALLOYS; BASIC ELECTRIC ELEMENTS; CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS; CHEMISTRY; CURRENT COLLECTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC SWITCHES; ELECTRICITY; EMERGENCY PROTECTIVE DEVICES; FERROUS OR NON-FERROUS ALLOYS; LINE CONNECTORS; METALLURGY; RELAYS; SELECTORS; SEMICONDUCTOR DEVICES; TREATMENT OF ALLOYS OR NON-FERROUS METALS

A copper alloy having improved resistance to cracking due to localized plastic deformation and the process of making it. The alloy consists essentially of: from 0.7 to 3.5 weight percent nickel; from 0.2 to 1 weight percent silicon; from 0.05 to 1 weight percent tin; from 0.26 to 1 weight percent iron; and the balance copper and unavoidable impurities. The copper alloy has a local ductility index of greater than 0.7 and a tensile elongation exceeding 5%. Cobalt may be substituted for iron, in whole or in part, on a 1:1 basis by weight. The alloy is precipitation hardenable and useful for electronic applications, including without limitation, connectors.