Triazine hardener and epoxy composition containing the same

A triazine compound having formula I or formula II:Wherein n is integer from 1 to 5;R1 is hydrogen, halogen, C1-C4 alkyl, or C1-C4 alkoxyl; andR2 is aliphatic amine, aliphatic alcohol, alicyclic amine or alicyclic alcohol, and an epoxy resin composition containing the triazine compound. The epoxy re...

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Bibliographic Details
Main Authors KANG HUNGOU, WANG SHIN-SHIN, YIN MENG-SONG, CHENG KUNG-LUNG, HONG SE-TSUN, HSU KUO-YUAN, MA JIE-HWA
Format Patent
LanguageEnglish
Published 01.05.2001
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HETEROCYCLIC COMPOUNDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC CHEMISTRY
ORGANIC MACROMOLECULAR COMPOUNDS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:A triazine compound having formula I or formula II:Wherein n is integer from 1 to 5;R1 is hydrogen, halogen, C1-C4 alkyl, or C1-C4 alkoxyl; andR2 is aliphatic amine, aliphatic alcohol, alicyclic amine or alicyclic alcohol, and an epoxy resin composition containing the triazine compound. The epoxy resin composition is suitable for the preparation of the structural substrate of printed circuit boards having low dielectric constant.
Bibliography:Application Number: US19990345873