Method and apparatus for forming solder on a substrate
The invention discloses a method for forming solder (114) on a substrate (112). The method includes forming a decal (110) with a plurality of solder regions (113). The method further comprises aligning the decal (110) with the substrate (112) and transferring the solder regions (113) on the decal (1...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
01.06.1999
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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