Method and apparatus for forming solder on a substrate
The invention discloses a method for forming solder (114) on a substrate (112). The method includes forming a decal (110) with a plurality of solder regions (113). The method further comprises aligning the decal (110) with the substrate (112) and transferring the solder regions (113) on the decal (1...
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| Main Authors | , |
|---|---|
| Format | Patent |
| Language | English |
| Published |
01.06.1999
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| Edition | 6 |
| Subjects | |
| Online Access | Get full text |
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| Abstract | The invention discloses a method for forming solder (114) on a substrate (112). The method includes forming a decal (110) with a plurality of solder regions (113). The method further comprises aligning the decal (110) with the substrate (112) and transferring the solder regions (113) on the decal (110) to the substrate (112). |
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| AbstractList | The invention discloses a method for forming solder (114) on a substrate (112). The method includes forming a decal (110) with a plurality of solder regions (113). The method further comprises aligning the decal (110) with the substrate (112) and transferring the solder regions (113) on the decal (110) to the substrate (112). |
| Author | HOTCHKISS; GREGORY B STEVENS; GARY D |
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| Notes | Application Number: US19970993636 |
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| PublicationYear | 1999 |
| RelatedCompanies | TEXAS INSTRUMENTS |
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| Snippet | The invention discloses a method for forming solder (114) on a substrate (112). The method includes forming a decal (110) with a plurality of solder regions... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| Title | Method and apparatus for forming solder on a substrate |
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