Method of preparing a printed circuit board
Disclosed is a printed circuit board and a method of preparing the printed circuit board, The printed circuit board has two types of plated through holes. The first type of plated through holes extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hol...
Saved in:
Main Authors | , , , , |
---|---|
Format | Patent |
Language | English |
Published |
24.09.1996
|
Edition | 6 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | Disclosed is a printed circuit board and a method of preparing the printed circuit board, The printed circuit board has two types of plated through holes. The first type of plated through holes extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hole module or component pin. The second type of plated through holes are for surface mount technology and terminate below the exterior surface of the printed circuit board. These plated through holes contain a fill composition. |
---|---|
AbstractList | Disclosed is a printed circuit board and a method of preparing the printed circuit board, The printed circuit board has two types of plated through holes. The first type of plated through holes extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hole module or component pin. The second type of plated through holes are for surface mount technology and terminate below the exterior surface of the printed circuit board. These plated through holes contain a fill composition. |
Author | BHATT; ANILKUMAR C MAGNUSON; ROY H POWELL; DOUGLAS O PAPATHOMAS; KONSTANTINOS I MARKOVICH; VOYA R |
Author_xml | – fullname: MARKOVICH; VOYA R – fullname: POWELL; DOUGLAS O – fullname: PAPATHOMAS; KONSTANTINOS I – fullname: MAGNUSON; ROY H – fullname: BHATT; ANILKUMAR C |
BookMark | eNrjYmDJy89L5WTQ9k0tychPUchPUygoSi1ILMrMS1dIBLIz80pSUxSSM4uSSzNLFJLyE4tSeBhY0xJzilN5oTQ3g7yba4izh25qQX58anFBYnJqXmpJfGiwqampuYWJiaMxYRUAk2UqVg |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
Edition | 6 |
ExternalDocumentID | US5557844A |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US5557844A3 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 13:01:45 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US5557844A3 |
Notes | Application Number: US19950463344 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19960924&DB=EPODOC&CC=US&NR=5557844A |
ParticipantIDs | epo_espacenet_US5557844A |
PublicationCentury | 1900 |
PublicationDate | 19960924 |
PublicationDateYYYYMMDD | 1996-09-24 |
PublicationDate_xml | – month: 09 year: 1996 text: 19960924 day: 24 |
PublicationDecade | 1990 |
PublicationYear | 1996 |
RelatedCompanies | INTERNATIONAL BUSINESS MACHINES CORPORATION |
RelatedCompanies_xml | – name: INTERNATIONAL BUSINESS MACHINES CORPORATION |
Score | 2.4659503 |
Snippet | Disclosed is a printed circuit board and a method of preparing the printed circuit board, The printed circuit board has two types of plated through holes. The... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
Title | Method of preparing a printed circuit board |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19960924&DB=EPODOC&locale=&CC=US&NR=5557844A |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwdR3JTsJA9AXRqDdFDe5zML0YItBOYw-NkS4hJgUi1HAjs7TYS9uUEn_fN7VVL9wmM8mb7a0zbwF46D_LWFhIgJTGJhooOvJBaxj3EBUMJgdC8oGKdw4m5jg03pZ02YLPJhamyhP6VSVHRIoSSO9lxa_zv0cst_Kt3DzxBLuyF39hu5qsw8XMPtoTmjuyvdnUnTqa49jhXJu825QiahrG6x7sKyVaZdn3PkYqJiX_L1D8EziYIay0PIVWlHbgyGnqrnXgMKi_u7FZU97mDB6DqtQzyWKSF5EqHZiuCSPqWQ51RiKSQmyTkvAMb_wc7n1v4Yx7OOvqd4OrcN4sT7-ANpr9URcIl7hMnTMrkrqBYoaxWEjUXuKhLqhO2SV0d0G52j10Dcc_fsfqX-UG2mWxjW5RrJb8rjqRbwXzfTI |
link.rule.ids | 230,309,786,891,25594,76903 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwdV1LT8JAEJ4gGvGmqMEnezC9GCLQbrWHxkhLg0qBSGu4Nd3dVrm0TSnx7ztdqXrhttlN9j0z-81jB-Cm-yBibiABUhrrCFBU5INGP-7gVdBC0eOC9cp4Z3eij3ztZUEXNfisYmHkP6Ff8nNEpCiO9F5Ifp39KbFs6Vu5umNLrEofHc-0FbEJF9O7iCcUe2AOZ1N7aimWZfpzZfJmUopXU9OedmD3HgGhBErvgzImJfsvUJxD2JthX0lxBLUoaULDqvKuNWHf3Zi7sbihvNUx3Loy1TNJY5LlUZk6MPkgISnVcvhmJHyZ8_WyICzFEz-BtjP0rFEHRw1-Fxj482p66inUEfZHLSBMUENTWWhEQtVQzIRhzAW-XuK-yqlKwzNobevlfHtTGxojzx0H4-fJ6wUc_PgglzaWS6gX-Tq6QhFbsGu5O98EYYAc |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Method+of+preparing+a+printed+circuit+board&rft.inventor=MARKOVICH%3B+VOYA+R&rft.inventor=POWELL%3B+DOUGLAS+O&rft.inventor=PAPATHOMAS%3B+KONSTANTINOS+I&rft.inventor=MAGNUSON%3B+ROY+H&rft.inventor=BHATT%3B+ANILKUMAR+C&rft.date=1996-09-24&rft.externalDBID=A&rft.externalDocID=US5557844A |