Laser soldering surface mount components of a printed circuit board

This disclosure relates to a process for laser soldering surface mount components on a printed circuit board using the continuous wave laser scanning technique. The process involves factoring together the scan rate, the beam diameter, and the laser power level, in order to determine what these speci...

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Bibliographic Details
Main Authors BRODEUR; MAURICE P, FREEDMAN; GARY M, ELMGREN; PETER J
Format Patent
LanguageEnglish
Published 27.02.1996
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:This disclosure relates to a process for laser soldering surface mount components on a printed circuit board using the continuous wave laser scanning technique. The process involves factoring together the scan rate, the beam diameter, and the laser power level, in order to determine what these specific process variables should be. In addition, the process also involves taking account of the depth of a metallic layer, such as a reference plane, inside the printed circuit board to determine its effect on other process variables. On the other hand, if the board does not have a metallic layer, the process takes account of the thickness of the board being processed. Preferred ranges for process variables are identified, as well as optimization techniques which further refine the process variables to achieve production efficiency or bonding pull strength.
Bibliography:Application Number: US19930071557