Molded waveguide components having electroless plated thermoplastic members

A microwave assembly having molded thermoplastic components that are first assembled into an enclosure, and then electroless copper plated to provide for RF conductivity. Assemblies are made by bonding bare thermoplastic components, after which the bonded assembly is electroless copper plated. The c...

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Bibliographic Details
Main Author KLEBE; DOUGLAS O
Format Patent
LanguageEnglish
Published 14.03.1995
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRICITY
PERFORMING OPERATIONS
PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE
RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
TRANSPORTING
WAVEGUIDES
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:A microwave assembly having molded thermoplastic components that are first assembled into an enclosure, and then electroless copper plated to provide for RF conductivity. Assemblies are made by bonding bare thermoplastic components, after which the bonded assembly is electroless copper plated. The components are made of an injection molding material, polyetherimide, or a high strength, high temperature thermoplastic. The components are assembled using a one component epoxy adhesive, for example. All components are designed to be self locating to aid in assembly. A bonding fixture is used to apply clamping pressure to the components while the adhesive cures. After bonding, the waveguide assembly has its critical flange surfaces finish machined prior to plating.
Bibliography:Application Number: US19920880123