High performance substrate, electronic package and integrated circuit cooling process

• Main Author: FITCH; JOHN S
• Format: Patent
• Language: English
• Published: 31.01.1995
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Integrated circuit package (10) includes a substrate (12) comprising a porous ceramic body (14). A non-porous covering (16) provides a hermetic seal around the porous ceramic body (14). A heat transfer liquid (18) partially fills pores (30) of the porous ceramic body (14). A plurality of integrated...