High performance substrate, electronic package and integrated circuit cooling process
Integrated circuit package (10) includes a substrate (12) comprising a porous ceramic body (14). A non-porous covering (16) provides a hermetic seal around the porous ceramic body (14). A heat transfer liquid (18) partially fills pores (30) of the porous ceramic body (14). A plurality of integrated...
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| Main Author | |
|---|---|
| Format | Patent |
| Language | English |
| Published |
31.01.1995
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| Edition | 6 |
| Subjects | |
| Online Access | Get full text |
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| Abstract | Integrated circuit package (10) includes a substrate (12) comprising a porous ceramic body (14). A non-porous covering (16) provides a hermetic seal around the porous ceramic body (14). A heat transfer liquid (18) partially fills pores (30) of the porous ceramic body (14). A plurality of integrated circuit chips (20) are attached to a surface of the substrate (12) by epoxy, solder or other bonds (22). On an opposite surface, the substrate (12) includes a plurality of heat transfer fins (24). In use, the heat transfer liquid (18) in the ceramic body (14) is vaporized to fill the balance of the pores (30) and condensed in a continuous heat pipe cycle to remove heat from the integrated circuits (20) mounted on the substrate. |
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| AbstractList | Integrated circuit package (10) includes a substrate (12) comprising a porous ceramic body (14). A non-porous covering (16) provides a hermetic seal around the porous ceramic body (14). A heat transfer liquid (18) partially fills pores (30) of the porous ceramic body (14). A plurality of integrated circuit chips (20) are attached to a surface of the substrate (12) by epoxy, solder or other bonds (22). On an opposite surface, the substrate (12) includes a plurality of heat transfer fins (24). In use, the heat transfer liquid (18) in the ceramic body (14) is vaporized to fill the balance of the pores (30) and condensed in a continuous heat pipe cycle to remove heat from the integrated circuits (20) mounted on the substrate. |
| Author | FITCH; JOHN S |
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| Edition | 6 |
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| Notes | Application Number: US19930130151 |
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| PublicationYear | 1995 |
| RelatedCompanies | DIGITAL EQUIPMENT CORPORATION |
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| Snippet | Integrated circuit package (10) includes a substrate (12) comprising a porous ceramic body (14). A non-porous covering (16) provides a hermetic seal around the... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | High performance substrate, electronic package and integrated circuit cooling process |
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