Method of manufacturing a printed wiring board

A method of manufacturing a printed wiring board is disclosed. The method comprises the steps of forming a printed circuit on a substrate, coating an insulating layer on at least a part of the printed circuit, coating a shield layer on at least a part of the insulating layer, and forming the shield...

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Bibliographic Details
Main Author SAITOH; YOSHITAKA
Format Patent
LanguageEnglish
Published 13.09.1994
Edition5
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A method of manufacturing a printed wiring board is disclosed. The method comprises the steps of forming a printed circuit on a substrate, coating an insulating layer on at least a part of the printed circuit, coating a shield layer on at least a part of the insulating layer, and forming the shield layer by a halftone dot.
Bibliography:Application Number: US19930163569