Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same

• Main Authors: ANDO; SETSUO, USHIO; JIRO, YOKONO; HITOSHI, KANDA; NAOYA, MIYAZAWA; OSAMU, OKUDAIRA; HIROAKI, TOMIZAWA; AKIRA, MATSUURA; NAOKO
• Format: Patent
• Language: English
• Published: 13.04.1993
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The present invention relates to an electroless gold plating solution, a method of plating by using the same, and an electronic device plated with gold by using the same. According to the present electroless gold plating solution, the plating solution components contain no cyanide ions, the amount o...