Flexible film chip carrier with decoupling capacitors
An electronic packaging structure includes a second level electronic package having at least one opening formed therein and circuitry for electrical connection to a semiconductor chip. A circuitized polyimide film chip carrier includes at least one semiconductor chip mounted on one major surface the...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English |
Published |
10.05.1988
|
Edition | 4 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | An electronic packaging structure includes a second level electronic package having at least one opening formed therein and circuitry for electrical connection to a semiconductor chip. A circuitized polyimide film chip carrier includes at least one semiconductor chip mounted on one major surface thereof and at least one decoupling capacitor mounted on an opposite surface thereof. The decoupling capacitor is electrically coupled to input/output contacts of the semiconductor chip. The carrier is then mounted on the second level electronic package so that one semiconductor chip is positioned within a respective opening and the circuitry formed on the carrier is coupled to the circuitry formed on the second level package thereby interconnecting the semiconductor chip to the electronic package. |
---|---|
AbstractList | An electronic packaging structure includes a second level electronic package having at least one opening formed therein and circuitry for electrical connection to a semiconductor chip. A circuitized polyimide film chip carrier includes at least one semiconductor chip mounted on one major surface thereof and at least one decoupling capacitor mounted on an opposite surface thereof. The decoupling capacitor is electrically coupled to input/output contacts of the semiconductor chip. The carrier is then mounted on the second level electronic package so that one semiconductor chip is positioned within a respective opening and the circuitry formed on the carrier is coupled to the circuitry formed on the second level package thereby interconnecting the semiconductor chip to the electronic package. |
Author | OLSON; LEONARD T CHARSKY; RONALD S BLACK; VINCENT J |
Author_xml | – fullname: BLACK; VINCENT J – fullname: OLSON; LEONARD T – fullname: CHARSKY; RONALD S |
BookMark | eNrjYmDJy89L5WQwdctJrchMyklVSMvMyVVIzsgsUEhOLCrKTC1SKM8syVBISU3OLy3IycxLB4oXJCZnluQXFfMwsKYl5hSn8kJpbgZ5N9cQZw_d1IL8-NRioLLUvNSS-NBgE3MTEwMDC0djwioAvCAuaA |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
Edition | 4 |
ExternalDocumentID | US4744008A |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US4744008A3 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 12:03:01 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US4744008A3 |
Notes | Application Number: US19870097322 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19880510&DB=EPODOC&CC=US&NR=4744008A |
ParticipantIDs | epo_espacenet_US4744008A |
PublicationCentury | 1900 |
PublicationDate | 19880510 |
PublicationDateYYYYMMDD | 1988-05-10 |
PublicationDate_xml | – month: 05 year: 1988 text: 19880510 day: 10 |
PublicationDecade | 1980 |
PublicationYear | 1988 |
RelatedCompanies | INTERNATIONAL BUSINESS MACHINES CORPORATION |
RelatedCompanies_xml | – name: INTERNATIONAL BUSINESS MACHINES CORPORATION |
Score | 2.3902965 |
Snippet | An electronic packaging structure includes a second level electronic package having at least one opening formed therein and circuitry for electrical connection... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS |
Title | Flexible film chip carrier with decoupling capacitors |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19880510&DB=EPODOC&locale=&CC=US&NR=4744008A |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwdV1LT8JAEJ4gGvWmqMF3D6a3Rgp9bA-NkT5CTHhEqOFG2t0tNMHSQIl_39mVqhdum9lk9pGZnX193wA86TZhvKMbmkUtUzNImuI6iLZMaIs4FuWpIbEw_YHVi4y3qTmtwaLCwkie0C9JjogeRdHfS7leF3-XWL78W7l5TjIUrV7Cieur7AcuhsaINqb6XTcYDf2hp3qeG43VwbtrCCK8Fnk9gEOxiRYs-8FHV2BSiv8BJTyDoxHqystzqPG8ASdelXetAcf93XM3Fneet7kAMxTMlcmSK2m2_FToIisUGq9FvjlF3KUqDM-RWwGvnaMcx5SJNDqX8BgGE6-nYfuz36HOonHV0c4V1PNVzpugOIy1nThOqE254bA2SWwrJczSCcPNTUKvoblPy83-qls4FROmSSbSO6iX6y2_xwBbJg9ybr4BYyqBHA |
link.rule.ids | 230,309,786,891,25594,76904 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwdV1LT8JAEJ4gGvGmqMEnPZjeGnn0sT00RloaVFqIgOFG6O4WmmBpoMS_7-wK6oXbZjaZfWRmZ1_fNwAPdYsw3qzrmklNQ9NJHOM6iLZMaI3YJuWxLrEwQWh2Rvrr2BgXYL7Dwkie0C9JjogeRdHfc7leZ3-XWJ78W7l-jBIULZ_8oeOp7AcuhsaINqZ6Lafd73k9V3VdZzRQw3dHF0R4NfJ8AIcWHggFy377oyUwKdn_gOKfwlEfdaX5GRR4WoaSu8u7VobjYPvcjcWt563PwfAFc2W04EqcLD4VOk8yhU5XIt-cIu5SFYbnyI2A185QjmNKRBqdC6j67aHb0bD9ye9QJ6PBrqPNSyimy5RXQLEZa9jTaUQtynWbNUhkmTFhZp0w3NxE9Aoq-7Rc76-qQqkzDLqT7kv4dgMnYvI0yUp6C8V8teF3GGzz6F7O0zeSH4QH |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Flexible+film+chip+carrier+with+decoupling+capacitors&rft.inventor=BLACK%3B+VINCENT+J&rft.inventor=OLSON%3B+LEONARD+T&rft.inventor=CHARSKY%3B+RONALD+S&rft.date=1988-05-10&rft.externalDBID=A&rft.externalDocID=US4744008A |