Method of passivating pn-junction in a semiconductor device
The surface termination of a p-n junction of a semiconductor device is passivated with semi-insulating material which is deposited on a thin layer of insulating material formed at the bared semiconductor surface by a chemical conversion treatment at a temperature above room temperature. The layer ma...
Saved in:
Main Author | |
---|---|
Format | Patent |
Language | English |
Published |
01.03.1983
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!