ELECTROPLATING CELL INCLUDING MEANS TO AGITATE THE ELECTROLYTE IN LAMINAR FLOW

An electroplating cell is constructed to prevent current spreading in the electrolyte during the plating of a metal or metal alloy onto a substrate. The cell is constructed such that the cross-sectional area of current path is substantially the same as the cross-sectional area of a pair of electrode...

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Bibliographic Details
Main Authors LUBOMYR T. ROMANKIW, JOHN V. POWERS
Format Patent
LanguageEnglish
Published 28.03.1972
Subjects
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
INDUCTANCES
MAGNETS
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
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Summary:An electroplating cell is constructed to prevent current spreading in the electrolyte during the plating of a metal or metal alloy onto a substrate. The cell is constructed such that the cross-sectional area of current path is substantially the same as the cross-sectional area of a pair of electrodes spaced apart in the cell. This is accomplished by placing the electrodes in the cell such that their edges are substantially in contact with the dielectric or insulating walls of the cell. The cell also contains electrolyte agitating means to provide uniform laminar flow of the electrolyte across the surface of one of the electrode. Metal alloy films deposited with the use of this cell exhibit uniform thicknesses on rather large surface areas. Where magnetic metal alloys are plated, the films not only exhibit uniform thicknesses laterally on the whole cathode but uniform composition and magnetic properties throughout as well.
Bibliography:Application Number: USD3652442