HIGH-FREQUENCY TRANSMISSION ELEMENT
A high-frequency transmission element is provided. The high-frequency transmission element includes a connecting wire structure and an impedance matching plate structure. The connecting wire structure includes a connecting wire and a connecting pad. The connecting pad is located at an end of the con...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
26.09.2024
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Subjects | |
Online Access | Get full text |
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Abstract | A high-frequency transmission element is provided. The high-frequency transmission element includes a connecting wire structure and an impedance matching plate structure. The connecting wire structure includes a connecting wire and a connecting pad. The connecting pad is located at an end of the connecting wire. The impedance matching plate structure includes an impedance matching plate body, an opening, and an impedance matching portion. The connecting pad is located in a projection range of the opening in a direction of orthographic projection of the impedance matching plate structure. The impedance matching portion is located in a periphery of the opening and extends in the direction from the connecting wire towards the connecting pad. |
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AbstractList | A high-frequency transmission element is provided. The high-frequency transmission element includes a connecting wire structure and an impedance matching plate structure. The connecting wire structure includes a connecting wire and a connecting pad. The connecting pad is located at an end of the connecting wire. The impedance matching plate structure includes an impedance matching plate body, an opening, and an impedance matching portion. The connecting pad is located in a projection range of the opening in a direction of orthographic projection of the impedance matching plate structure. The impedance matching portion is located in a periphery of the opening and extends in the direction from the connecting wire towards the connecting pad. |
Author | Yang, Sheng-Fan Cheng, Yu-Lin Liao, Huan-Yi Yeh, Chi-Lou |
Author_xml | – fullname: Yeh, Chi-Lou – fullname: Liao, Huan-Yi – fullname: Cheng, Yu-Lin – fullname: Yang, Sheng-Fan |
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RelatedCompanies | Global Unichip Corporation Taiwan Semiconductor Manufacturing Company, Ltd |
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Snippet | A high-frequency transmission element is provided. The high-frequency transmission element includes a connecting wire structure and an impedance matching plate... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRICITY RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE WAVEGUIDES |
Title | HIGH-FREQUENCY TRANSMISSION ELEMENT |
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