PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION REACTORS AND ASSOCIATED METHODS

• Main Authors: Black, Lucas, O'Shaughnessy, W. Shannan, Fernandez, Sergio, Grant, Andrew
• Format: Patent
• Language: English
• Published: 22.08.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

Plasma-enhanced chemical vapor deposition (PECVD) reactors and methods of fabricating polymers via PECVD processes are generally provided. In some embodiments, a PECVD reactor has one or more features that enhance the quality of the polymers that may be formed therein. Similarly, some methods are pe...