Electronic device and manufacturing method thereof

The disclosure discloses a manufacturing method of an electronic device, which comprises the following steps: providing a first substrate, providing a second substrate, bonding the first substrate and the second substrate through an adhesive layer, forming a conductive layer on the side surfaces of...

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Bibliographic Details
Main Authors DAI, Yan-Tang, YAN, Tzu-Min
Format Patent
LanguageEnglish
Published 15.08.2024
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:The disclosure discloses a manufacturing method of an electronic device, which comprises the following steps: providing a first substrate, providing a second substrate, bonding the first substrate and the second substrate through an adhesive layer, forming a conductive layer on the side surfaces of the first substrate, the second substrate and the adhesive layer, performing a first patterning process on a first region of the conductive layer, and performing a second patterning process on a second region of the conductive layer, the first region at least partially overlaps the adhesive layer, and the second region overlaps the side surfaces of the first substrate and the second substrate, and the first patterning process is different from the second patterning process.
Bibliography:Application Number: US202418406222