PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

• Main Author: CHEN, Ying-Chung
• Format: Patent
• Language: English
• Published: 18.07.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

At least some embodiments of the present disclosure relate to an electronic structure. The package structure includes a lead frame, an electronic component, and a conductive wire physically and electrically connecting the electronic component to the lead frame. An elevation of a first end of the con...