METHOD AND STRUCTURE FOR FINFET DEVICE
The present disclosure provides a method, which includes forming a first fin structure and a second fin structure over a substrate, which has a first trench positioned between the first and second fin structures. The method also includes forming a first dielectric layer within the first trench, rece...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
30.05.2024
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Subjects | |
Online Access | Get full text |
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