METHOD AND STRUCTURE FOR FINFET DEVICE

The present disclosure provides a method, which includes forming a first fin structure and a second fin structure over a substrate, which has a first trench positioned between the first and second fin structures. The method also includes forming a first dielectric layer within the first trench, rece...

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Bibliographic Details
Main Authors Ching, Kuo-Cheng, Leung, Ying-Keung
Format Patent
LanguageEnglish
Published 30.05.2024
Subjects
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